文献
J-GLOBAL ID:201702231924402926
整理番号:17A0755731
スルーシリコンビア(TSV)欠陥モデリング,測定,及び解析【Powered by NICT】
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
著者 (12件):
Jung Daniel H.
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea)
,
Kim Youngwoo
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea)
,
Kim Jonghoon J.
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea)
,
Kim Heegon
(Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA)
,
Choi Sumin
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea)
,
Song Yoon-Ho
(Electronics and Telecommunications Research Institute, Daejeon, South Korea)
,
Bae Hyun-Cheol
(Electronics and Telecommunications Research Institute, Daejeon, South Korea)
,
Choi Kwang-Seong
(Electronics and Telecommunications Research Institute, Daejeon, South Korea)
,
Piersanti Stefano
(Department of Industrial and Information Engineering and Economics, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy)
,
de Paulis Francesco
(Department of Industrial and Information Engineering and Economics, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy)
,
Orlandi Antonio
(Department of Industrial and Information Engineering and Economics, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy)
,
Kim Joungho
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
7
号:
1
ページ:
138-152
発行年:
2017年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)