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J-GLOBAL ID:201702234596444377
整理番号:17A0970106
液体すずはんだにより仲介される大規模陽極ボンディング【Powered by NICT】
Large-scale anodic bonding mediated by a liquid tin solder
著者 (8件):
Claure Ramirez Ernesto
(Laboratory for Building Energy Materials and Components, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
,
Klemencic Robert
(Laboratory for Building Energy Materials and Components, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
,
Klucka Martin
(Laboratory for Building Energy Materials and Components, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
,
Lang Britta
(Fraunhofer Institute for Mechanics of Materials IWM, Wohlerstrasse 11, 79108 Freiburg, Germany)
,
Beisel Samuel
(Fraunhofer Institute for Solar Energy Systems (ISE), Heidenhofstrasse 2, 79110 Freiburg, Germany)
,
Altorfer Heinz
(Mechanical Design and Workshop Facilities, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
,
Koebel Matthias M.
(Laboratory for Building Energy Materials and Components, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
,
Malfait Wim J.
(Laboratory for Building Energy Materials and Components, Empa, Swiss Federal Laboratories for Material Science and Technology, UEberlandstrasse 129, CH 8600 Duebendorf, Switzerland)
資料名:
Journal of Materials Processing Technology
(Journal of Materials Processing Technology)
巻:
246
ページ:
69-76
発行年:
2017年
JST資料番号:
H0650A
ISSN:
0924-0136
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)