文献
J-GLOBAL ID:201702235936379409
整理番号:17A0876283
Low-Temperature and Low-Pressure Cu-Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
著者 (8件):
LI Junjie
(Huazhong Univ. Sci. and Technol.)
,
YU Xing
(Huazhong Univ. Sci. and Technol.)
,
SHI Tielin
(Huazhong Univ. Sci. and Technol.)
,
CHENG Chaoliang
(Huazhong Univ. Sci. and Technol.)
,
FAN Jinhu
(Huazhong Univ. Sci. and Technol.)
,
CHENG Siyi
(Huazhong Univ. Sci. and Technol.)
,
LIAO Guanglan
(Huazhong Univ. Sci. and Technol.)
,
TANG Zirong
(Huazhong Univ. Sci. and Technol.)
資料名:
Nanoscale Research Letters (Web)
(Nanoscale Research Letters (Web))
巻:
12
号:
1
ページ:
12:255 (WEB ONLY)
発行年:
2017年12月
JST資料番号:
U7001A
ISSN:
1931-7573
資料種別:
逐次刊行物 (A)
発行国:
イギリス (GBR)
言語:
英語 (EN)