文献
J-GLOBAL ID:201702236014207721
整理番号:17A1555287
Sn-9Znはんだバンプのせん断特性に及ぼすリフロー時間の影響【Powered by NICT】
Effect of reflow time on shear property of Sn-9Zn solder bumps
著者 (5件):
Sun Menglong
(Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China)
,
Zhao Qinghua
(Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China)
,
Wang Dongfan
(Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China)
,
Hu Anmin
(Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China)
,
Li Ming
(Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, 200240, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1035-1038
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)