文献
J-GLOBAL ID:201702239042238142
整理番号:17A1555283
Al/Ni自己伝搬箔を用いた結合IGBTチップとDBC基板の温度場のシミュレーション【Powered by NICT】
Simulation of the temperature field for bonding IGBT chip and DBC substrate using Al/Ni self-propagating foil
著者 (5件):
Xiang Yuyan
(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China)
,
Zhou Zheng
(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China)
,
Mo Liping
(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China)
,
Hui Liu
(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China)
,
Wu Fengshun
(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1016-1020
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)