文献
J-GLOBAL ID:201702243474463808
整理番号:17A1555303
高ガラス転移温度と高い熱伝導率を持つ液体エポキシ成形化合物【Powered by NICT】
Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity
著者 (6件):
Li Jinze
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Zhang Baotan
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Zhu Pengli
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Li Gang
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Sun Rong
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Wong Chingping
(Department of Electronics Engineering, The Chinese University of Hong Kong, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1107-1112
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)