文献
J-GLOBAL ID:201702243552015895
整理番号:17A1627517
非反応性ナノ充填剤を含むSnBiはんだ合金のクリープ抵抗の向上:ナノインデンテーションを用いた研究【Powered by NICT】
Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: A study using nanoindentation
著者 (5件):
Shen Lu
(Singapore Institute of Technology, 10 Dover Drive, 138683, Singapore Singapore)
,
Shen Lu
(School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore)
,
Foo Asta Qili
(School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore)
,
Wang Shijie
(Institute of Materials Research and Engineering, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, Singapore 138634, Singapore)
,
Chen Zhong
(School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
729
ページ:
498-506
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)