文献
J-GLOBAL ID:201702244001530333
整理番号:17A1256489
センサ実装技術の特性評価のためのテスト構造【Powered by NICT】
Test structures for the characterisation of sensor packaging technology
著者 (8件):
Blair E.O.
(Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Buchoux A.
(Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Tsiamis A.
(Institute for Bioengineering, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Dunare C.
(Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Marland J.R.K.
(Institute for Bioengineering, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Terry J.G.
(Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Smith S.
(Institute for Bioengineering, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
,
Walton A.J.
(Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, SMC, Alexander Crum Brown Road, EH9 3FF, UK)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICMTS
ページ:
1-6
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)