文献
J-GLOBAL ID:201702244129707983
整理番号:17A0012430
ガラス・イン・シリコン・リフロー・プロセスに基づく頑健で低消費電力の二次元温度風センサ
A robust and low-power 2-D thermal wind sensor based on a glass-in-silicon reflow process
著者 (6件):
Zhu Yan-qing
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
,
Chen Bei
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
,
Gao Di
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
,
Qin Ming
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
,
Huang Qing-an
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
,
Huang Jian-qiu
(Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China)
資料名:
Microsystem Technologies
(Microsystem Technologies)
巻:
22
号:
1
ページ:
151-162
発行年:
2016年01月
JST資料番号:
W2056A
ISSN:
0946-7076
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)