文献
J-GLOBAL ID:201702247731101387
整理番号:17A0335398
C4F4/Ar誘導結合プラズマを用いた溶融石英の深部ドライエッチング
Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas
著者 (11件):
LIN Laicun
(Inst. of Microelectronics, Chinese Acad. of Sci., Beijing, CHN)
,
LIN Laicun
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
,
JING Xiangmeng
(Inst. of Microelectronics, Chinese Acad. of Sci., Beijing, CHN)
,
JING Xiangmeng
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
,
LIU Fengman
(Inst. of Microelectronics, Chinese Acad. of Sci., Beijing, CHN)
,
LIU Fengman
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
,
YIN Wen
(Inst. of Microelectronics, Chinese Acad. of Sci., Beijing, CHN)
,
YIN Wen
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
,
YU Daquan
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
,
CAO Liqiang
(Inst. of Microelectronics, Chinese Acad. of Sci., Beijing, CHN)
,
CAO Liqiang
(National Center for Advanced Packaging (NCAP), Wuxi, CHN)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
28
号:
1
ページ:
480-486
発行年:
2017年01月
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)