文献
J-GLOBAL ID:201702249842598434
整理番号:17A0329103
2.5D貫通シリコンインターポーザ(TSI)における高帯域幅相互接続設計の機会【Powered by NICT】
High bandwidth interconnect design opportunities in 2.5D Through-Silicon interposer (TSI)
著者 (7件):
Weerasekera Roshan
(University of the West of England in Bristol, UK)
,
Chang Ka Fai
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, 08-02 Innovis Tower, Singapore 138634)
,
Zhang Songbai
(Sky-works Solutions, Singapore)
,
Katti Guruprasad
(Bank of America for Randstad Technologies, USA)
,
Li Hong Yu
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, 08-02 Innovis Tower, Singapore 138634)
,
Dutta Rahul
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, 08-02 Innovis Tower, Singapore 138634)
,
Cubillo Joseph Romen
(3D Montblanc (http://www.3dmontblanc.com), France)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
EPTC
ページ:
241-244
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)