文献
J-GLOBAL ID:201702249997770624
整理番号:17A0451542
電子相互接続の凝固中のCu_6Sn_5結晶成長機構【Powered by NICT】
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
著者 (6件):
Xian J.W.
(Department of Materials, Imperial College, London, SW7 2AZ, UK)
,
Belyakov S.A.
(Department of Materials, Imperial College, London, SW7 2AZ, UK)
,
Ollivier M.
(Department of Materials, Imperial College, London, SW7 2AZ, UK)
,
Nogita K.
(Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical & Mining Engineering, The University of Queensland, St Lucia, QLD 4072, Australia)
,
Yasuda H.
(Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto, 606-8501, Japan)
,
Gourlay C.M.
(Department of Materials, Imperial College, London, SW7 2AZ, UK)
資料名:
Acta Materialia
(Acta Materialia)
巻:
126
ページ:
540-551
発行年:
2017年
JST資料番号:
A0316A
ISSN:
1359-6454
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)