文献
J-GLOBAL ID:201702250315499349
整理番号:17A1555240
無電解銅/ニッケルめっきのための中空PdCu合金触媒【Powered by NICT】
Hollow PdCu alloy catalysts for electroless copper/nickel deposition
著者 (7件):
Sheng Guoqing
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Chen Jiahui
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Zhang Futao
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Yuen Matthew M.F.
(Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, China)
,
Fu Xian-Zhu
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Sun Rong
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China)
,
Wong Ching-Ping
(Department of Electronics Engineering, The Chinese University of Hong Kong, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
824-827
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)