文献
J-GLOBAL ID:201702251542983591
整理番号:17A0052851
エレクトロマイグレーションと熱応力の結合した影響の下でのマイクロボールグリッドアレイ(μBGA)はんだ接合部の劣化挙動
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress
著者 (6件):
Liu Baolei
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Tian Yanhong
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Qin Jingkai
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
An Rong
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
,
Zhang Rui
(Scottish Microelectronics Centre, University of Edinburgh, Edinburgh, UK)
,
Wang Chenxi
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
27
号:
11
ページ:
11583-11592
発行年:
2016年11月
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)