文献
J-GLOBAL ID:201702252500187476
整理番号:17A1025932
信頼性,高温及び高出力ダイ接着相互接続のためのナノ多孔性銅の低温,有機物自由焼結【Powered by NICT】
Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections
著者 (6件):
Mohan Kashyap
(3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA)
,
Shahane Ninad
(3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA)
,
Raj Pulugurtha Markondeya
(3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA)
,
Antoniou Antonia
(Mechanical Engineering, Georgia Institute of Technology)
,
Smet Vanessa
(3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA)
,
Tummala Rao
(3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA USA)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
APEC 2017
ページ:
3083-3090
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)