文献
J-GLOBAL ID:201702253211167276
整理番号:17A1550630
ダイヤモンドワイヤソーによるsawnシリコンウエハの厚さの予測【Powered by NICT】
Prediction of the thickness for silicon wafers sawn by diamond wire saw
著者 (6件):
Liu Tengyun
(School of Mechanical Engineering, Shandong University, Jinan 250061, China)
,
Ge Peiqi
(School of Mechanical Engineering, Shandong University, Jinan 250061, China)
,
Ge Peiqi
(Key Laboratory of High-Efficiency and Clean Mechanical Manufacture at Shandong University, Ministry of Education, Jinan 250061, China)
,
Bi Wenbo
(School of Mechanical Engineering, Shandong University, Jinan 250061, China)
,
Bi Wenbo
(Key Laboratory of High-Efficiency and Clean Mechanical Manufacture at Shandong University, Ministry of Education, Jinan 250061, China)
,
Wang Peizhi
(School of Mechanical Engineering, Shandong University, Jinan 250061, China)
資料名:
Materials Science in Semiconductor Processing
(Materials Science in Semiconductor Processing)
巻:
71
ページ:
133-138
発行年:
2017年
JST資料番号:
W1055A
ISSN:
1369-8001
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)