文献
J-GLOBAL ID:201702255267711848
整理番号:17A0329058
高温endurable気密封止材料選択と信頼性比較赤外ガスセンサモジュールの実装【Powered by NICT】
High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging
著者 (6件):
Au K. Y.
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Singapore 138634)
,
Zhi Ding Mian
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Singapore 138634)
,
Chidambaram Vivek
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Singapore 138634)
,
Lin Bu
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Singapore 138634)
,
Piotr Kropelnicki
(Excelitas Technologies Singapore, Pte. Ltd)
,
KaiLiang Chuan
(Excelitas Technologies Singapore, Pte. Ltd)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
EPTC
ページ:
1-5
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)