文献
J-GLOBAL ID:201702255827960465
整理番号:17A0407763
Sn-3.0Ag-0.5Cu-0.1TiO_2はんだ接合部の界面IMC成長に及ぼす継手サイズと等温時効の影響【Powered by NICT】
Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
著者 (5件):
Li Z.L.
(School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China)
,
Cheng L.X.
(College of Electronic Engineering, South China Agriculture University, Guangzhou 510642, China)
,
Li G.Y.
(School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China)
,
Huang J.H.
(School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China)
,
Tang Y.
(College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
697
ページ:
104-113
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)