文献
J-GLOBAL ID:201702256436372321
整理番号:17A1705405
酸素プラズマ処理後の酸化したSiウエハへのNCFの接着【Powered by NICT】
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
著者 (5件):
Jang Min-Seok
(Division of Materials Science & Engineering, Hanyang University, Seoul 133-791, Republic of Korea)
,
Ma Sung Woo
(Division of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791, Republic of Korea)
,
Song Jongsoo
(Department of Chemistry, Hanyang University, Seoul 133-791, Republic of Korea)
,
Sung Myungmo
(Department of Chemistry, Hanyang University, Seoul 133-791, Republic of Korea)
,
Kim Young-Ho
(Division of Materials Science & Engineering, Hanyang University, Seoul 133-791, Republic of Korea)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
78
ページ:
220-226
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)