文献
J-GLOBAL ID:201702256910985548
整理番号:17A0362531
発光ダイオードモジュールの劣化に及ぼすストレス負荷試験法の影響【Powered by NICT】
Effects of stress-loading test methods on the degradation of light-emitting diode modules
著者 (10件):
Cai Miao
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Yang Daoguo
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Zheng Jianna
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Huang Jianlin
(Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands)
,
Liu Dongjing
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Xiao Jing
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Zhang Ping
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Zhang Guoqi
(School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China)
,
Zhang Guoqi
(Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Delft, The Netherlands)
,
Chen Xianping
(College of Optoelectronic Engineering, Chongqing University, Chongqing, China)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
64
ページ:
635-639
発行年:
2016年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)