文献
J-GLOBAL ID:201702260374118414
整理番号:17A1418780
無電解析出による金ナノ構造活性化ポリピロールの銅メタライゼーション【Powered by NICT】
Copper Metallization of Gold Nanostructure Activated Polypyrrole by Electroless Deposition
著者 (5件):
Pandey Richa
(Department of Physical Electronics, Faculty of Engineering, Tel-Aviv University, Ramat-Aviv 69978, Israel)
,
Jian Nan
(Nanoscale Physics Research Laboratory, School of Physics and Astronomy, University of Birmingham, Edgbaston, Birmingham B15 2TT, United Kingdom)
,
Inberg Alexandra
(Department of Physical Electronics, Faculty of Engineering, Tel-Aviv University, Ramat-Aviv 69978, Israel)
,
Palmer Richard E.
(Nanoscale Physics Research Laboratory, School of Physics and Astronomy, University of Birmingham, Edgbaston, Birmingham B15 2TT, United Kingdom)
,
Shacham-Diamand Yosi
(Department of Physical Electronics, Faculty of Engineering, Tel-Aviv University, Ramat-Aviv 69978, Israel)
資料名:
Electrochimica Acta
(Electrochimica Acta)
巻:
246
ページ:
1210-1216
発行年:
2017年
JST資料番号:
B0535B
ISSN:
0013-4686
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)