文献
J-GLOBAL ID:201702263273869220
整理番号:17A0057924
HEMTパッケージにおけるAu-Sn共晶型付属品層の信頼性最適化【Powered by NICT】
Reliability optimization of gold-tin eutectic die attach layer in HEMT package
著者 (7件):
Zhang Hao
(Beijing Research Center, Delft University of Technology, Beijing, China)
,
Fan Jiajie
(Beijing Research Center, Delft University of Technology, Beijing, China)
,
Zhang Jing
(Changzhou Institute of Technology Research for Solid State Lighting, Changzhou, China)
,
Qian Cheng
(Changzhou Institute of Technology Research for Solid State Lighting, Changzhou, China)
,
Fan Xuejun
(Changzhou Institute of Technology Research for Solid State Lighting, Changzhou, China)
,
Sun Fenglian
(Harbin University of Science and Technology, Harbin, China)
,
Zhang Guoqi
(Changzhou Institute of Technology Research for Solid State Lighting, Changzhou, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
SSLChina
ページ:
52-56
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)