文献
J-GLOBAL ID:201702263346087105
整理番号:17A0756743
無電解Niめっきによる低温,常圧でのCu-Cu結合【Powered by NICT】
Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating
著者 (4件):
Yang S.
(Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan, No.1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan (R.O.C))
,
Hung H. T.
(Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan, No.1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan (R.O.C))
,
Chen Y. B.
(Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan, No.1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan (R.O.C))
,
Kao C. R.
(Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan, No.1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan (R.O.C))
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
IMPACT
ページ:
111-114
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)