文献
J-GLOBAL ID:201702264347321992
整理番号:17A1555308
3D相互接続モデルとその応用パッケージ-オン-パッケージ【Powered by NICT】
A 3D interconnection model and its applications in Package on Package
著者 (5件):
Zhou Yang
(Department of Microsystem, China Electronics Technology Group Corporation No.38 Research Institute, Hefei, China)
,
Wang Bo
(Department of Microsystem, China Electronics Technology Group Corporation No.38 Research Institute, Hefei, China)
,
Liu Jianfeng
(Department of Microsystem, China Electronics Technology Group Corporation No.38 Research Institute, Hefei, China)
,
Wu Bowen
(Department of Microsystem, China Electronics Technology Group Corporation No.38 Research Institute, Hefei, China)
,
Ma Qiang
(Department of Microsystem, China Electronics Technology Group Corporation No.38 Research Institute, Hefei, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1130-1132
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)