文献
J-GLOBAL ID:201702266403132480
整理番号:17A0057817
モノリシック3D集積プラットフォーム開発のための結合に基づいたチャネル移動と低温プロセス【Powered by NICT】
Bonding based channel transfer and low temperature process for monolithic 3D integration platform development
著者 (8件):
Choi Rino
(Department of Materials Science and Engineering, Inha University, Incheon 402-751, Korea)
,
Yu Hyun-Yong
(School of Electrical Engineering, Korea University, Seoul 136-701, Korea)
,
Kim Hyungsub
(School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Korea)
,
Ryu Han-Youl
(Department of Physics, Inha University, Incheon 402-751, Korea)
,
Bae Hee-Kyung
(National NanoFab Center (NNFC), Daejon 34141, Korea)
,
Choi Kevin Kinam
(The Bondis, Hwaseong 18449, Korea)
,
Cha Yong-Won
(The Bondis, Hwaseong 18449, Korea)
,
Choi Changhwan
(Division of Materials science and Engineering, Hanyang University, Seoul 04763, Korea)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
S3S
ページ:
1-2
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)