文献
J-GLOBAL ID:201702268164351301
整理番号:17A1555254
フリップチップアンダーフィル応用のためのナノサイズSiO_2充填剤の表面改質【Powered by NICT】
Surface modification of nano-size SiO2 filler for flip chip underfill applications
著者 (7件):
Li Gang
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
He Yachuan
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
Zhu Pengli
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
Zhao Tao
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
Lu Daoqiang Daniel
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
Sun Rong
(Guangdong Provincial Key Laboratory of Materials for High Density Electronic Packaging, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)
,
Wong Chingping
(Department of Electronics Engineering, Chinese University of Hong Kong, Shatin NT, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
883-887
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)