文献
J-GLOBAL ID:201702268735832415
整理番号:17A0456738
一定条件に曝された電子機器匡体における湿度蓄積【Powered by NICT】
Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions
著者 (6件):
Conseil-Gudla H.
(Department of Mechanical Engineering, Materials and Surface Engineering, Technical University of Denmark, Kongens Lyngby, Denmark)
,
Staliulionis Z.
(Department of Mechanical Engineering, Process Modelling Group, Technical University of Denmark, Kongens Lyngby, Denmark)
,
Jellesen M. S.
(Department of Mechanical Engineering, Materials and Surface Engineering, Technical University of Denmark, Kongens Lyngby, Denmark)
,
Jabbari M.
(Department of Mechanical Engineering, Process Modelling Group, Technical University of Denmark, Kongens Lyngby, Denmark)
,
Hattel J. H.
(Department of Mechanical Engineering, Process Modelling Group, Technical University of Denmark, Kongens Lyngby, Denmark)
,
Ambat R.
(Department of Mechanical Engineering, Materials and Surface Engineering, Technical University of Denmark, Kongens Lyngby, Denmark)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
7
号:
3
ページ:
412-423
発行年:
2017年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)