文献
J-GLOBAL ID:201702268805982595
整理番号:17A0193761
SiCを主材料とするセラミック母材複合体のためのタングステン-レニウム薄膜熱電対
Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites
著者 (7件):
Tian Bian
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Zhang Zhongkai
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Shi Peng
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Zheng Chen
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Yu Qiuyue
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Jing Weixuan
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
,
Jiang Zhuangde
(State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi, China)
資料名:
Review of Scientific Instruments
(Review of Scientific Instruments)
巻:
88
号:
1
ページ:
015007-015007-5
発行年:
2017年01月
JST資料番号:
D0517A
ISSN:
0034-6748
CODEN:
RSINAK
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)