文献
J-GLOBAL ID:201702269220250759
整理番号:17A0445824
応答曲面法を用いた先端半導体製造のためのタングステンCMPスラリーの多目的最適化【Powered by NICT】
Multi-objective optimization of tungsten CMP slurry for advanced semiconductor manufacturing using a response surface methodology
著者 (9件):
Seo Jihoon
(Department of Energy Engineering, Hanyang University, Seoul, South Korea)
,
Kim Joo Hyun
(Department of Energy Engineering, Hanyang University, Seoul, South Korea)
,
Lee Myoungjae
(Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea)
,
You Keungtae
(Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea)
,
Moon Jinok
(Department of Energy Engineering, Hanyang University, Seoul, South Korea)
,
Moon Jinok
(Clean/CMP Technology Team, Memory, Samsung Electronics, Hwaseong, South Korea)
,
Lee Dong-Hee
(College of Interdisciplinary Industrial Studies, Hanyang University, Seoul, South Korea)
,
Paik Ungyu
(Department of Energy Engineering, Hanyang University, Seoul, South Korea)
,
Paik Ungyu
(Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea)
資料名:
Materials & Design
(Materials & Design)
巻:
117
ページ:
131-138
発行年:
2017年
JST資料番号:
A0495B
ISSN:
0264-1275
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)