文献
J-GLOBAL ID:201702269307650920
整理番号:17A0470086
3D ICパッケージングのためのTSV熱挙動に与える寸法パラメータと欠陥の影響【Powered by NICT】
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
著者 (5件):
Pan Yuanxing
(State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China)
,
Li Fei
(State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China)
,
He Hu
(State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China)
,
Li Junhui
(State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China)
,
Zhu Wenhui
(State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
70
ページ:
97-102
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)