文献
J-GLOBAL ID:201702269534788728
整理番号:17A0403022
選択的表面改質および無電解めっきを用いたポリマ上への銅回路パターン形成【Powered by NICT】
Copper circuit patterning on polymer using selective surface modification and electroless plating
著者 (7件):
Park Sang Jin
(Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764, Republic of Korea)
,
Ko Tae-Jun
(Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650, Republic of Korea)
,
Ko Tae-Jun
(Department of Materials Science and Engineering, Seoul National University, Seoul 151-742, Republic of Korea)
,
Yoon Juil
(Department of Mechanical Systems Engineering, Hansung University, Seoul 136-792, Republic of Korea)
,
Moon Myoung-Woon
(Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650, Republic of Korea)
,
Oh Kyu Hwan
(Department of Materials Science and Engineering, Seoul National University, Seoul 151-742, Republic of Korea)
,
Han Jun Hyun
(Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764, Republic of Korea)
資料名:
Applied Surface Science
(Applied Surface Science)
巻:
396
ページ:
1678-1684
発行年:
2017年
JST資料番号:
B0707B
ISSN:
0169-4332
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)