文献
J-GLOBAL ID:201702269794447579
整理番号:17A0402860
ULSI-CuメタライゼーションのためのNiCrB拡散障壁層膜の無電解析出【Powered by NICT】
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
著者 (6件):
Wang Yuechun
(School of Materials Science and Engineering, Yunnan University, Kunming, China)
,
Chen Xiuhua
(School of Materials Science and Engineering, Yunnan University, Kunming, China)
,
Ma Wenhui
(National Engineering Laboratory of Vacuum Metallurgy, Kunming University of Science and Technology, Kunming, China)
,
Shang Yudong
(School of Materials Science and Engineering, Yunnan University, Kunming, China)
,
Lei Zhengtao
(School of Materials Science and Engineering, Yunnan University, Kunming, China)
,
Xiang Fuwei
(School of Materials Science and Engineering, Yunnan University, Kunming, China)
資料名:
Applied Surface Science
(Applied Surface Science)
巻:
396
ページ:
333-338
発行年:
2017年
JST資料番号:
B0707B
ISSN:
0169-4332
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)