文献
J-GLOBAL ID:201702274647097317
整理番号:17A0410774
Sn-Ag-CuはんだとCu基板との間の固相界面反応に及ぼすAg添加の影響【Powered by NICT】
Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate
著者 (7件):
Yang Ming
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999, Republic of Korea)
,
Ko Yong-Ho
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999, Republic of Korea)
,
Ko Yong-Ho
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Bang Junghwan
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999, Republic of Korea)
,
Kim Taek-Soo
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Lee Chang-Woo
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999, Republic of Korea)
,
Li Mingyu
(Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, People’s Republic of China)
資料名:
Materials Characterization
(Materials Characterization)
巻:
124
ページ:
250-259
発行年:
2017年
JST資料番号:
D0448C
ISSN:
1044-5803
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)