文献
J-GLOBAL ID:201702275469540487
整理番号:17A1712374
繰返し曲げ試験中の厚さ方向による柔軟な基板上のCu薄膜における微小亀裂の発生と伝播【Powered by NICT】
Initiation and propagation of microcracks in Cu thin films on flexible substrates through the thickness direction during a cyclic bending test
著者 (2件):
Bag Atanu
(Department of Printed Electronics Engineering, Sunchon National University, Suncheon, Jeonnam 57922, Republic of Korea)
,
Choi Shi-Hoon
(Department of Printed Electronics Engineering, Sunchon National University, Suncheon, Jeonnam 57922, Republic of Korea)
資料名:
Materials Science & Engineering. A. Structural Materials: Properties, Microstructure and Processing
(Materials Science & Engineering. A. Structural Materials: Properties, Microstructure and Processing)
巻:
708
ページ:
60-67
発行年:
2017年
JST資料番号:
D0589B
ISSN:
0921-5093
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)