文献
J-GLOBAL ID:201702275847291718
整理番号:17A0381606
集積マイクロ蒸発器を用いたパッケージ後のシリコン共振器の周波数トリミング【Powered by NICT】
Frequency trimming of silicon resonators after package with integrated micro-evaporators
著者 (5件):
You Weilong
(State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China)
,
Yang Heng
(State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China)
,
Pei Binbin
(State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China)
,
Sun Ke
(State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China)
,
Li Xinxin
(State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
MEMS
ページ:
917-919
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)