文献
J-GLOBAL ID:201702276631224073
整理番号:17A1555406
低温における機械的性質と混合SnAgCu SnPbはんだ継手の微細構造【Powered by NICT】
Mechanical properties and microstructure of mixed SnAgCu-SnPb solder joints at cryogenic temperature
著者 (4件):
Ma Bin
(National Defence Key Disciplines Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, China)
,
Zhou Bin
(Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China)
,
Wang Shanlin
(National Defence Key Disciplines Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, China)
,
Li Xunping
(Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1582-1585
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)