文献
J-GLOBAL ID:201702279075261833
整理番号:17A1705418
金属間化合物粒径とグリーンエレクトロニクスのための鉛フリーはんだの機械的性質に及ぼす熱時効の影響【Powered by NICT】
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics
著者 (4件):
Aamir Muhammad
(Department of Mechanical Engineering, CECOS University of IT & Emerging Sciences, Peshawar, Pakistan)
,
Muhammad Riaz
(Department of Mechanical Engineering, CECOS University of IT & Emerging Sciences, Peshawar, Pakistan)
,
Ahmed Naseer
(Department of Mechanical Engineering, CECOS University of IT & Emerging Sciences, Peshawar, Pakistan)
,
Waqas Muhammad
(Department of Electronic Engineering, Tsinghua University, Beijing, China)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
78
ページ:
311-318
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)