文献
J-GLOBAL ID:201702279956624596
整理番号:17A0756742
ドライエッチング技術を用いた薄膜高分子におけるフレックス回路パネルの分離【Powered by NICT】
Flex circuit depaneling in thin film polymer using dry etching technology
著者 (11件):
Lin Jim-Wein
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Liu De-Shiang
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Lin Chen-Hao
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Wang Chih-Lun
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Chen Jui-Tang
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Wang Cheng-Hsiung
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Kuo Chi-Hai
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Yang Kai-Ming
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Hung Yin-Po
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Ko Cheng-Ta
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
,
Chen Yu-Hua
(Unimicron Technology Corp., No.290, Chung-Lun Village, Hsin-Feng, Hsinchu, Taiwan, 304)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
IMPACT
ページ:
107-110
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)