文献
J-GLOBAL ID:201702280707537916
整理番号:17A1555301
Sn58Biはんだの溶融特性,湿潤性とミクロ組織に及ぼす微量AgとCu添加の影響【Powered by NICT】
Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solder
著者 (6件):
Jiang D.P.
(School of Mechanical and Power Engineering, Chongqing University of Science and Technology, 401331, China)
,
Yao Z.X.
(School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, 401331, China)
,
Yin L.M.
(School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, 401331, China)
,
Wang G.
(School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, 401331, China)
,
Li D.
(School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, 401331, China)
,
Tian X.K.
(School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, 401331, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
1098-1101
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)