文献
J-GLOBAL ID:201702281785929140
整理番号:17A0363846
超音波支援過渡液相はんだ付けプロセスにおけるCu/Sn/Cu継手におけるCu_3Snの非界面成長【Powered by NICT】
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
著者 (11件):
Zhao H.Y.
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Zhao H.Y.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Liu J.H.
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Liu J.H.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Li Z.L.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Zhao Y.X.
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Zhao Y.X.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Niu H.W.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Song X.G.
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Song X.G.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
,
Dong H.J.
(Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China)
資料名:
Materials Letters
(Materials Letters)
巻:
186
ページ:
283-288
発行年:
2017年
JST資料番号:
E0935A
ISSN:
0167-577X
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)