文献
J-GLOBAL ID:201702282539654795
整理番号:17A0747163
冷間焼結プロセスセラミックパッケージングとマイクロ波デバイス開発のための新しい時代【Powered by NICT】
Cold sintering process: A new era for ceramic packaging and microwave device development
著者 (5件):
Guo Jing
(Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania)
,
Baker Amanda L.
(Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania)
,
Guo Hanzheng
(Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania)
,
Lanagan Michael
(Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania)
,
Randall Clive A.
(Department of Materials Science and Engineering, Materials Research Institute, Center for Dielectrics and Piezoelectrics, The Pennsylvania State University, University Park, Pennsylvania)
資料名:
Journal of the American Ceramic Society
(Journal of the American Ceramic Society)
巻:
100
号:
2
ページ:
669-677
発行年:
2017年
JST資料番号:
C0253A
ISSN:
0002-7820
CODEN:
JACTAW
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)