文献
J-GLOBAL ID:201702284057224722
整理番号:17A0444868
エレクトロマイグレーション中のSn15Biはんだ接合における近共晶相層の生成【Powered by NICT】
Generation of near eutectic phase layer in Sn-15Bi solder joint during electro-migration
著者 (4件):
Du Chengchao
(School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China)
,
Wang Xue
(School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China)
,
Wang Xue
(State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
,
Lai Zhongmin
(School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China)
資料名:
Materials Letters
(Materials Letters)
巻:
191
ページ:
193-195
発行年:
2017年
JST資料番号:
E0935A
ISSN:
0167-577X
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)