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J-GLOBAL ID:201702284570757088
整理番号:17A0448071
はんだジェット技術で印刷したバンプの高さ偏差に関する実験的研究【Powered by NICT】
Experimental investigation on the height deviation of bumps printed by solder jet technology
著者 (8件):
Xiong Wei
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi′an 710072, China)
,
Qi Lehua
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi′an 710072, China)
,
Qi Lehua
(Education Ministry Key Laboratory of Modern Design and Integrated Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China)
,
Luo Jun
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi′an 710072, China)
,
Luo Jun
(Education Ministry Key Laboratory of Modern Design and Integrated Manufacturing Technology, Northwestern Polytechnical University, Xi’an 710072, China)
,
Zhang Daicong
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi′an 710072, China)
,
Liang Junhao
(School of Material, Northwestern Polytechnical University, Xi′an 710072, China)
,
Yi Hao
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi′an 710072, China)
資料名:
Journal of Materials Processing Technology
(Journal of Materials Processing Technology)
巻:
243
ページ:
291-298
発行年:
2017年
JST資料番号:
H0650A
ISSN:
0924-0136
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)