文献
J-GLOBAL ID:201702284679218491
整理番号:17A0754704
CuAl合金障壁層システムによる二酸化けい素と予防における銅の拡散の物理的,化学的および電気的特性評価【Powered by NICT】
Physical, chemical and electrical characterisation of the diffusion of copper in silicon dioxide and prevention via a CuAl alloy barrier layer system
著者 (10件):
Byrne C.
(School of Physical Sciences, Dublin City University, Dublin 9, Ireland)
,
Brennan B.
(National Physical Laboratory, Hampton Road, Teddington TW11 0LW, United Kingdom)
,
Lundy R.
(Stokes Laboratories, University of Limerick, Co. Limerick, Ireland)
,
Bogan J.
(School of Physical Sciences, Dublin City University, Dublin 9, Ireland)
,
Brady A.
(School of Physical Sciences, Dublin City University, Dublin 9, Ireland)
,
Gomeniuk Y.Y.
(Tyndall National Institute, University College Cork, Lee Maltings, Prospect Row, Cork, Ireland)
,
Gomeniuk Y.Y.
(V. Lashkaryov Institute of Semiconductor Physics, NAS of Ukraine, 41, pr. Nauki, Kyiv, Ukraine)
,
Monaghan S.
(Tyndall National Institute, University College Cork, Lee Maltings, Prospect Row, Cork, Ireland)
,
Hurley P.K.
(Tyndall National Institute, University College Cork, Lee Maltings, Prospect Row, Cork, Ireland)
,
Hughes G.
(School of Physical Sciences, Dublin City University, Dublin 9, Ireland)
資料名:
Materials Science in Semiconductor Processing
(Materials Science in Semiconductor Processing)
巻:
63
ページ:
227-236
発行年:
2017年
JST資料番号:
W1055A
ISSN:
1369-8001
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)