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J-GLOBAL ID:201702286339765317
整理番号:17A0668322
100Gbit/s/応用のためのフリップチップ相互接続EA-DFBレーザモジュール【Powered by NICT】
Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application
著者 (10件):
Kanazawa Shigeru
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Tsunashima Satoshi
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Nakanishi Yasuhiko
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Muramoto Yoshifumi
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Ueda Yuta
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Tanobe Hiromasa
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Sanjoh Hiroaki
(NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Yamazaki Hiroshi
(NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Kobayashi Wataru
(NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
,
Ishii Hiroyuki
(NTT Device Technology Laboratories, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
ICSJ
ページ:
25-28
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)