文献
J-GLOBAL ID:201702286351887350
整理番号:17A0329195
3D製造プロセスに基づいたCu-TSVの統合モデルの熱機械的信頼性【Powered by NICT】
Thermomechanical reliability of a Cu-TSV integration model based on 3D fabrication processes
著者 (8件):
Sun Yunna
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Lee Seung-lo
(Samsung Electronics Co., Ltd., Test & Package (TP) Center #723, Buksu-Ri, Baebang-Eup, Asan-City, Chungchung Nam-do, Korea 31489, Korea)
,
Liu Yanmei
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Luo Jiangbo
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Wang Yan
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Ding Guifu
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Wang Hong
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
,
Yao Jingyuan
(National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
EPTC
ページ:
704-708
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)