文献
J-GLOBAL ID:201702286439244548
整理番号:17A0471600
Sn2.5Ag0.7Cu0.1REはんだ合金のぬれ性と微細構造に及ぼすNi添加の影響【Powered by NICT】
Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy
著者 (7件):
Wang Yaoli
(School of Materials Science and Engineering, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Wang Yaoli
(Research Center for High Purity Materials, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Wang Guangxin
(School of Materials Science and Engineering, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Wang Guangxin
(Research Center for High Purity Materials, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Song Kexing
(School of Materials Science and Engineering, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Zhang Keke
(Research Center for High Purity Materials, Henan University of Science & Technology, Luoyang 471003, PR China)
,
Zhang Keke
(Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, Henan Province, PR China)
資料名:
Materials & Design
(Materials & Design)
巻:
119
ページ:
219-224
発行年:
2017年
JST資料番号:
A0495B
ISSN:
0264-1275
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)