文献
J-GLOBAL ID:201702286447080450
整理番号:17A0013978
ZnOドープSn3.0Ag0.5Cu複合材料はんだ接合部のZnO残留率,微細構造の進展及び機械特性に関する調査
An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints
著者 (7件):
Peng Hao
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, China)
,
Chen Guang
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, China)
,
Chen Guang
(Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
,
Mo Liping
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, China)
,
Chan Y. C.
(Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, China)
,
Wu Fengshun
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, China)
,
Liu Hui
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, China)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
27
号:
9
ページ:
9083-9093
発行年:
2016年09月
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)