文献
J-GLOBAL ID:201702289972203624
整理番号:17A0448948
CoSb_3ベース熱電素子の接合における界面反応【Powered by NICT】
Interfacial reactions at the joints of CoSb3-based thermoelectric devices
著者 (3件):
Chen Sinn-wen
(Department of Chemical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-fu Road, Hsinchu, 30013, Taiwan)
,
Chu Alan Hwader
(Department of Chemical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-fu Road, Hsinchu, 30013, Taiwan)
,
Wong David Shan-Hill
(Department of Chemical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-fu Road, Hsinchu, 30013, Taiwan)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
699
ページ:
448-454
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)