文献
J-GLOBAL ID:201702290458746456
整理番号:17A0451521
Cu/V多層膜の電気抵抗率に及ぼす温度とサイズ効果【Powered by NICT】
The temperature and size effect on the electrical resistivity of Cu/V multilayer films
著者 (7件):
Wang P.P.
(State Key Laboratory of Nuclear Physics and Technology, School of Physics, Peking University, Beijing 100871, PR China)
,
Wang X.J.
(State Key Laboratory of Advanced Optical Communication Systems and Networks, Peking University, Beijing 100871, PR China)
,
Du J.L.
(State Key Laboratory of Nuclear Physics and Technology, School of Physics, Peking University, Beijing 100871, PR China)
,
Ren F.
(School of Physics and Technology, Wuhan University, Wuhan 430072, PR China)
,
Zhang Y.
(Institute of Condensed Matter and Material Physics, School of Physics, Peking University, Beijing 100871, PR China)
,
Zhang X.
(School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA)
,
Fu E.G.
(State Key Laboratory of Nuclear Physics and Technology, School of Physics, Peking University, Beijing 100871, PR China)
資料名:
Acta Materialia
(Acta Materialia)
巻:
126
ページ:
294-301
発行年:
2017年
JST資料番号:
A0316A
ISSN:
1359-6454
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)